Copper Base Plate for IGBT Modules
What is this part? Copper Base Plate for IGBT Modules is a Base Plate manufactured from T2Y2 copper by Balford. Production process: Precision Stamping → Surface Treatment. Finish: Nickel sulfamate electroplating. Key requirements: No burrs, bright appearance, no scratches, bumps or indentations; tight visual and dimensional standards.
Precision Metal Stamping
| Product Name | Copper Base Plate for IGBT Modules |
|---|---|
| Category | Base Plate |
| Process Flow | Precision Stamping→Surface Treatment |
| Material | T2Y2 copper |
| Surface Treatment | Nickel sulfamate electroplating |
| Hardness | 80-100 HV |
| Key requirements | No burrs, bright appearance, no scratches, bumps or indentations; tight visual and dimensional standards |
Case Review
Nickel sulfamate electroplating gives the copper base plate consistent color, low internal stress, and good ductility. The surface finish on the purple copper plate has to meet tight visual and dimensional standards. Manufacturing process: T2Y2 copper, blanking, fine blanking Application: New energy electric vehicles, photovoltaic power semiconductor IGBT modules Stamping material: T2Y2 copper, hardness 80-100 HV Surface Finish: Nickel sulfamate plating Product features: No burrs, bright appearance, no scratches, no bumps, or indentations
