Copper Base Plate for IGBT Modules
Nickel sulfamate electroplating gives the copper base plate consistent color, low internal stress, and good ductility. The surface finish on the purple copper plate has to meet tight visual and dimensional standards.
Case Review
- Manufacturing process: T2Y2 copper, blanking, fine blanking
- Application: New energy electric vehicles, photovoltaic power semiconductor IGBT modules
- Stamping material: T2Y2 copper, hardness 80-100 HV
- Surface Finish: Nickel sulfamate plating
- Product features: No burrs, bright appearance, no scratches, no bumps, or indentations